Thermal adhesive bond

Setting system for sandwich structures TSS

Insertion System for sandwich constructions TSS

Thermal adhesive bond
Following the trend to lightweight construction, breaking new ground in connection technology is essential. The TSS system allows placing of plastic bosses in sandwich structures, which consist of a honeycomb or foam core with outer layers of fiber-reinforced plastics (e.g., CRP or GRP). During the TSS joining process, the plastic components are melted, creating a thermal adhesive bond. Placing the plastic bosses is carried out with or without a pilot hole and can be implemented with robotic assistance.

Individual parameters
The TSS process is applied as a robot-assisted system or a closed setting facility in a cell. Domes are used directly as fasteners or robust threaded inserts for self-tapping screws. The entire process is freely configurable and can be documented.

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Compact Spindle [mm] (LxWxH) 630 x 185 x 165
Spindle weight [kg] ca. 13
EC drive [U/min] > 5.000
Max. axial force [N] 1.400
Clock cycle (without cooling) [s] from 3